Description
Technical Specifications:
- 3D Printing Technology Patent-pending Optical Panel (User replaceable)
- Advanced cure depth control
- Direct peel mechanism
- Automatic resin heating Resin Curing Unit 385 nm UV-A LED with dedicated cooling
- Factory calibrated for light uniformity and intensity Minimum Feature Size 35 µm (XY Resolution)
- Layer Thickness Options 50, 100, 170 µm
- Resin Tank 500 mL capacity
- Protective cover
- RFID tracking
- Build Platform 188 x 105 mm build area
- Onboard automatic heater
- Anodized aluminum build surface
- Standard Print Speed Up to 2” per hour
- Build Platform 105 x 75 mm build area
- Onboard automatic heater
- Hard anodized aluminum build surface
- Max capacity Print Speed Up to 4” per hour
- Connectivity 2.4 and 5 GHz Wi-Fi chipset
- Local network via Wi-Fi b/g/n
- Local network via Ethernet cable
- User Controls 12” ultrawide glass touchscreen
- Direct print via front-facing USB-C port
- Android-based PrintOS onboard software
- 8-core onboard computer
- Power Requirement 100-240V, 50-60Hz, 400 watts
- Operating Temperature Range 70 – 85°F (21 – 29°C)
- Unit Dimensions
- (W x D x H) UV Lid Closed 15 x 18 x 21 in. 38 x 45 x 53 cm
- UV Lid Open 15 x 23 x 27 in. 38 x 58 x 69 cm
- Weight 65 lb. 30 k
